COPPER NUGGET

PHOSPHORUS BEARING COPPER ANODE (Cu-DXP)
OXYGEN FREE COPPER ANODE (Cu-OF)

Ideal Anode Material For Copper Electroplating Processes
All types of nuggets are produced in Outokumpu Upcast® process.Cu-OF nuggets have very high copper purity.
Phosphorus bearing copper anodes are alloyed by adding phosphorus into pure molten copper to have homogeneously dispersed alloy. Cu-DXP copper nuggets are ideal for printed circuit board (PCB) plating because of excellent deposition properties.
Phosphorus content of Cu-DXP nuggets are between 0,04% and 0,06% which are ideal anodes for acidic plating baths.

TYPICAL ANALYSIS Phosphorus (Cu-DXP) Oxygen Free (Cu-OF) % Cu 99.940 min. 99.995 min. % P 0.04 – 0.06 % < 2 ppm IMPURITIES Bi, Mn < 1 ppm Al, As, Ni, Si < 5 ppm S < 10 ppm Sb, Sn, Te < 5 ppm Zn < 10 ppm Ag < 15 ppm Fe, Pb < 10 ppm

DIMENSIONS Diameter (mm) Length (mm) (mm) (inch) (mm) (inch) 8 0.315 10-400 0.39 – 15.75 12,5 0.492 10-400 0.39 – 15.75 20 0.787 20-400 0.39 – 15.75 PACKING Ø 44 lb (20 kg) in plastic bucket Ø 1100 – 2200 lb (500 – 1000 kg) in wooden box Ø 1100 – 2200 lb (500 – 1000 kg) in steel barrel Ø 2200 lb (1000 kg) in big bag *Please contact our Marketing Department for other nugget sizes and type of packing.