Copper Nugget

COPPER NUGGET

PHOSPHORUS BEARING COPPER ANODE (Cu-DXP)
OXYGEN FREE COPPER ANODE (Cu-OF)


Ideal Anode Material For Copper Electroplating Processes
All types of nuggets are produced in Outokumpu Upcast® process.Cu-OF nuggets have very high copper purity.
Phosphorus bearing copper anodes are alloyed by adding phosphorus into pure molten copper to have homogeneously dispersed alloy. Cu-DXP copper nuggets are ideal for printed circuit board (PCB) plating because of excellent deposition properties.
Phosphorus content of Cu-DXP nuggets are between 0,04% and 0,06% which are ideal anodes for acidic plating baths.



TYPICAL ANALYSIS
Phosphorus
(Cu-DXP)
Oxygen Free
(Cu-OF)
% Cu 99.940 min. 99.995 min.
% P 0.04 – 0.06 % < 2 ppm

IMPURITIES
Bi, Mn < 1 ppm
Al, As, Ni, Si < 5 ppm
S < 10 ppm
Sb, Sn, Te < 5 ppm
Zn < 10 ppm
Ag < 15 ppm
Fe, Pb < 10 ppm
DIMENSIONS
Diameter (mm) Length (mm)
(mm) (inch) (mm) (inch)
8 0.315 10-400 0.39 – 15.75
12,5 0.492 10-400 0.39 – 15.75
20 0.787 20-400 0.39 – 15.75

PACKING
Ø 44 lb (20 kg) in plastic bucket
Ø 1100 – 2200 lb (500 – 1000 kg) in wooden box
Ø 1100 – 2200 lb (500 – 1000 kg) in steel barrel
Ø 2200 lb (1000 kg) in big bag
*Please contact our Marketing Department for other nugget sizes and type of packing.

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